As an experienced full service partner for the development and production of printed and organic electronics, we give you insights into innovative, fully automatic production processes for a variety of flexible and rigid substrates (e.g. PET, PEN, TPU, PI, Kapton, PC and many more). Material thicknesses of 50 µm to 3 mm can be used.
The production of the finest conductive structures (< 50 µm) with the highest quality standards requires experience and production conditions completely under clean room conditions. Witte Technologie GmbH offers the latest technology for the production of hybrid flexible electronics with precise footprints for connecting microchips.
