Only the dimensions are standardised: At the same time as the launch of the product catalogue, Bopla Gehäuse Systeme GmbH are restructuring their range of 19” products. Now the customer-specific assembly systems are divided into subrack and desktop enclosures, small control enclosures for the fitting of 19” subracks and front panels. In addition, BOPLA manufactures non-standard enclosures for PCBs. The ideal solution when developers require a package of services from planning to sampling to series manufacture to packaging – and all available from a single source. This ensures that BOPLA is meeting increased demands and expectations from the market.
A specially-printed front panel. A desktop enclosure which can also be integrated in a cabinet. A 19” enclosure for a special size of PCB which doesn’t conform to the Euro card format. And, not least, customer-specific packaging. The demands made of 19” subracks and other assembly systems are increasing. It’s not just the sturdy outer case which is important – increasingly, customer-specific equipment details are an integral part of development. Olaf Kleineberg, BOPLA’s product manager for 19” subracks, understands that a competent partner for subracks is more important than ever: “Using the standardised 19” system as a basis, we manufacture the individual systems that our customers ask for. In addition to the wide range of products, our huge depth of production allows us to produce a unique total package from a single source.”
Always in accordance with DIN EN 60297-3-101
Developers can choose between BOPLA’s metal and plastic applications for the 19”-compliant enclosures used for their electronics systems. All the components are standardised in accordance with DIN EN 60297-3-101. The different designs and sizes and a wide range of accessories provide a high degree of flexibility for different applications. In doing this, the range of products makes both standard and EMC versions available.